Workflow from Scientific Research

Open access visualization of Workflow, Illustration, LTOI, Wafer Bonding, Hydrogen-Ion Implantation
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DOI: 10.1038/s41586-024-07369-1

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Schematic of the LTOI wafer-bonding workflow showing hydrogen-ion implantation, bonding, splitting and chemical mechanical polishing (CMP).

#Workflow#Illustration#LTOI#Wafer Bonding#Hydrogen-Ion Implantation#Chemical Mechanical Polishing

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